ASTM F638-88(2001)

system ASTM 2017-08-16 6 PDF 370 0 2026-07-04 03:36
summary
Standard Specification for Fine Aluminum-1% Magnesium Wire for Semiconductor Lead-Bonding (Withdrawn 2006)
description

Scope

1.1 This specification covers aluminum-1% magnesium alloy wire for internal connections in semiconductor devices and is limited to wires of diameter up to and including 0.002 in. (0.051 mm). For diameters larger than 0.0020 in. (0.051 mm), the specifications are to be agreed upon between the purchaser and the supplier.

1.2 The values stated in inch-pound units are to be regarded as the standard. The values stated in parentheses are for information only.

Details
Publisher ASTM
File size 62.32 KB
Pages 3
Format PDF
Publication date 2017-08-16