IPC

IPC TM-650 2.4.40 1987

Inner Layer Bond Strength of Multilayer Printed Circuit Boards

IPC TM-650 2.4.4.1A 1994

Flexural Strength of Laminates (at Elevated Temperature)

IPC TM-650 2.4.3E 2011

IPC TM-650 2.4.39A 1986

Dimensional Stability, Glass Reinforced Thin Laminates

IPC TM-650 2.4.37A 1991

Evaluation of Hand Soldering Tools for Terminal Connections

IPC TM-650 2.4.37.2 1993

Evaluation of Hand Soldering Tools on Heavy Thermal Loads

IPC TM-650 2.4.36C 2004

Rework Simulation, Plated-Through Holes for Leaded Components

IPC TM-650 2.4.35 1995

Solder Paste - Slump Test

IPC TM-650 2.4.34.4 1995

Paste Flux Viscosity - T-Bar Spindle Method

IPC TM-650 2.4.34.3 1995

Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)