IPC

IPC IPC-JPCA-2315 2000

IPC IPC/JEDEC-9707-AM1 2018

Spherical Bend Test Method for Characterization of Board Level Interconnects

IPC IPC-JEDEC-9706 2013

IPC IPC-JEDEC-9702 2004

IPC IPC/JEDEC J-STD-033D 2018

Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

IPC IPC/JEDEC J-STD-033C- 2014

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

IPC IPC/JEDEC J-STD-020E 2015

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

IPC IPC-EIA J-STD-028 1999

Performance Standard for Construction of Flip Chip and Chip Scale Bumps

IPC IPC-EIA J-STD-026 1999

Semiconductor Design Standard for Flip Chip Applications

IPC HM-860 1987

Specification for Multilayer Hybrid Circuits