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Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-Layer Seperations
Details
Publisher
IPC
File size
768.76 KB
Pages
56
Format
PDF
Publication date
2001-12-01
ISBN-13
978-5-932-23710-6
ISBN-13 plain
9785932237106
ISBN-10
5932237100