IPC

IPC TR-579-1988

IPC TR-486 2001

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluatio...

IPC TR-485 1991

Results of Copper Foil Rupture Strength Test Round Robin Study

IPC TR-484 1986

Results of IPC Copper Foil Ductility Round Robin Study

IPC TR-476A 1997

Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

IPC TR-470 1974

Thermal Characteristics of Multilayer Interconnection Boards

IPC TR-467 1996

Supporting Data and Numerical Examples for ANSI/J-STD-001B: Appendix D (Control of Fluxes)

IPC TR-466 1995

Wetting Balance Standard Weight Comparison Test

IPC TR-465-3 1996

Evaluation of Steam Aging on Alternative Finishes Round Robin Test Program Phase IIA

IPC TR-465-1 1993

Round Robin Test on Steam Ager Temperature Control Stability