jedec JEP 122G
JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.
JEDEC JESD47M-2025
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JEDEC US-001-B 0
Standard - Tape Automated Bonding (TAB) Package Family. S-PQUC-X/TAB.
JEDEC UO-018-B 0
Registration - Metric Super Format Tape Automated Bonding (TAB) Package Family.
JEDEC UO-017-A 0
Registration - Tape Automated Bonding (TAB) Package, 10, 15 and 20 mil Pitch Uncased Outline. Item 11.4-235/236/237.
JEDEC TS-005-A 0
Standard - Surface Mounted Header Family, 2 Leads, Peripheral Terminals. R-PSFM-G. Item 11.10-327S.
JEDEC TS-004-A 0
Standard - Flange-Mounted Header Family. R-PSFM-F3. Item 11.10-326S.
JEDEC TS-003-B 0
Standard - Header Family, Surface Mounted, Peripheral Terminals. R-PSFM-G2. Item 11.10-323S.
JEDEC TS-002-A 0
Standard - Header Family, Insertion Mount, Peripheral Terminals. Item 11.10-322S
JEDEC TS-001-A 0
Standard - Plastic Single-in-Line Flange-Mounted, 5 Leads. PSFM. Item 11.10-220.
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JEDEC CS-002-A 1993
Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
JEDEC JEP162A-2019
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jedec JEP 122G
JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.
JEDEC JESD79-3-3 2013
ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM
JEDEC JESD79-4-1B-2021
IPC JEDEC 9703-2009 (2019)
IPC JEDEC 9301-2018
EIA JEDEC JESD67-1999 errata 1999
JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
JEDEC JESD79-5B-2022
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline
JEDEC SO-014A 2008
Registration - DDR3 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. SKT. Item 11.14-123
JEDEC CO-014-A 1989
Registration - 2 inch Leaded Quadpack Carrier.