loading preview...
summary
Design Requirements - Punch-Singulated, Fine Pitch, Square, Very Thin and Very Very Thin Profile, Leadframe-Based Quad No-Lead Staggared Dual-Row Packages, (with optional Thermal Enhancements) QFN.
Details
Publisher
JEDEC
File size
219.55 KB
Pages
11
Format
PDF
Publication date
2005-12-01
