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summary
Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.
Details
Publisher
JEDEC
File size
173.6 KB
Pages
7
Format
PDF
Publication date
2003-12-01
