A comprehensive reference covering semiconductor manufacturing fundamentals, process technologies, packaging, equipment, facilities, and sustainability.
Semiconductor Manufacturing Handbook, Second Edition, edited by Hwaiyu Geng, provides an extensive reference for the science, engineering, and operations of modern semiconductor production. The handbook covers semiconductor manufacturing fundamentals, front-end-of-line and back-end-of-line processes, flexible and large-area electronics, process gases and chemicals, equipment, facilities, testing, quality control, packaging, and sustainability. Topics include nanotechnology, FinFETs, MEMS, 3D integrated circuits, epitaxy, thermal processing, microlithography, etching, ion implantation, physical and chemical vapor deposition, atomic layer deposition, planarization, wafer processing, assembly, and manufacturing operations.
Application Scope: Suitable for semiconductor engineers, process and equipment professionals, manufacturing managers, researchers, students, and technical organizations involved in chip fabrication and electronics manufacturing.
