JEDEC MO-312A 2013
Registration - 4 Lead Flat and Gullwing Surface Mount Power Package. HB1-PDSO, HB1-PSOF
JEDEC MO-311D 2014
Registration - Dual-Pitch, Thin and Very Thin Profile, Rectangular Die Size BGA, 0.80 mm X 0.65 mm Pitch. (T,V)FR-xDSBGA
JEDEC MO-310C 2014
Registration - 260 Pin DDR4 SODIMM, 0.50 mm Pitch. DIMM
JEDEC MO-309F 2015
Registration - 288 Pin DDR4 DIMM, 0.85 mm Pitch. DIMM
JEDEC MO-308A 2012
Registration - Thick Thermally Enhanced Fine Pitch Square Ball Grid Array Family. BF-XBGA
JEDEC MO-307A 2011
Registration - Dual-Pitch, rectangular Ball Grid Array package, 0.50 mm x 0.65 mm Pitch. LFR-XBGA
JEDEC MO-306A 2011
Registration - Flange Mounted Family Surface Mount (Peripheral Terminals). HR-PSFM-G.
JEDEC MO-305C 2013
Registration - Wide I/O Micropillar Grid Array Package (MPGA) (X2,X3,X4)F(R)-SCDS
JEDEC MO-304D 2013
Registration - Ball Grid Array Family, Rectangular, 1.0 mm pitch. (V, T, L) R-PBGA
JEDEC MO-303B 2012
Registration - Land Grid Array Family, Rectangular, 0.50 mm Pitch
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JEDEC JESD79-3-3 2013
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JEDEC JESD79-4-1B-2021
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JEDEC CS-002-A 1993
Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
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JEDEC JESD82-30.01-2023
JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
EIA JEDEC JESD67-1999 errata 1999
JEDEC JESD88E 2013
DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline