JEDEC SRAM3.7.2 1997
Bit Wide ECL SRAM
JEDEC SRAM3.7.10 2008
High Speed DDR SRAM in 165 BGA
JEDEC SRAM3.7.1 1995
Bit Wide TTL SRAM
JEDEC SRAM3.7 2001
SRAM Introduction
JEDEC SPP-025B 2016
Standard Practices and Procedures - Package Variation Designators
JEDEC SPP-024A 2009
Standard Practices and Procedures - Reflow Flatness Requirements for Ball Grid Array Packages. Item 11.2-783
JEDEC SPP-023B 2013
Standard Practices and Procedures - Module Insertion Procedure for DIMM and miniDIMM Connectors
JEDEC SPP-022B 2006
Standard Practices and Procedures - Thermal Pad Requirements. Item 11.2-748(S)
JEDEC SPP-021A 2006
Standard Practices and Procedures - Change Record Methodology. Item 11.2-710(S)
JEDEC SPP-020A 2003
WITHDRAWN: Standard Practices and Procedures - Rectangular Grid Array Terminal Position Numbering. Item 11.2-641(S)
Hot Products
JEDEC JESD82-513-2023
JEDEC JESD82-511-2021
JEDEC JESD79-5C-2024
JEDEC JESD82-512-2023
JEDEC JESD79-3F-2012
JEDEC JESD79-4D-2021
JEDEC JESD79-5B-2022
JEDEC JEP162A-2019
jedec JEP 122G
JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.
JEDEC JESD79-3-3 2013
ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM
JEDEC JESD79-4-1B-2021
JEDEC CS-002-A 1993
Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
IPC JEDEC 9301-2018
IPC JEDEC 9703-2009 (2019)
JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
JEDEC JESD82-30.01-2023
EIA JEDEC JESD67-1999 errata 1999
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline
JEDEC CO-014-A 1989
Registration - 2 inch Leaded Quadpack Carrier.