loading preview...
summary
BS EN IEC 61189-3-302. Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 3-302. Detection of plating defects in unpopulated circuit boards by computed tomography (CT) | Status: Current, Draft for public comment
Details
Publisher
BS
File size
1003.82 KB
Pages
18
Format
PDF
Publication date
2024-03-08