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summary
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for copper foil for use in the manufacture of copper-clad base materials | Status: Current
Details
Publisher
BS
File size
379.65 KB
Pages
14
Format
PDF
Publication date
1990-02-28
ISBN-13
978-0-580-18190-0
ISBN-13 plain
9780580181900
ISBN-10
0580181901