What is BS EN 140401-803 - Fixed low power film SMD resistors about?  
BS EN 140401-802 is the 803rd part of the multi-series on fixed low power film SMD resistors, that focuses on cylindrical base for surface mounting.
Who is BS EN 140401-803 - Fixed low power film SMD resistors for? 
BS EN 140401-803 on Fixed low power film SMD resistors is useful for: 
- Manufacturers of SMD resistors
- Manufacturers of printed circuit boards
- Manufacturers of electronic equipment and components
- Quality control and testing authorities
- Product design engineers
Why should you use BS EN 140401-803 - Fixed low power film SMD resistors?  
Resistors are used to limit the flow of current in a circuit. Constant resistors are commonly employed in circuit designs because they have a fixed-resistance and assist to limit the flow of current at a specific level.
BS EN 140401-803 provides guidance on characteristics and ratings, climatic categories, tests related to soldering, and quality assessment procedures. Ratings for stability class are also covered.
To prove the compatibility of resistors according to this specification with lead-free solder, e.g. SnCu, SnCuNi, SnAg or SnAgCu, and traditional SnPb solder, solderability shall be tested with both types of solder. Solderability of the special products with leader-bearing termination plating shall be tested with traditional SnPb solder only.
BS EN 140401-803 covers the test method for assessing resistance to soldering heat test called the soldering bath method (stability class 2; 1; 0,5; 0,25) and solder reflow method (stability class 0,1; 0,05). Test on resistance to electrostatic discharge is also provided.
If you are a manufacturer, fixed low power film SMD resistors made in compliance with BS EN 140401-803 can help demonstrate the reliability and performance of the product, as per your specific application needs.
What’s changed since the last update?
BS EN 140401-802:2007+A3:2017 supersedes BS EN 140401-803:2007+A2:2013 which is withdrawn. Compared to the superseded standard, the following changes have been implemented:
- Introduction of a test on the resistance to electrostatic discharge
- Introduction of description and test methods for lead-free soldering
- Introduction of the code letters for temperature coefficient as given in EN 60062
- Revision of the ordering information
- Revised information on pulse load capability, resistance value drift, current noise
- The adoption of the IECQ rules of procedure, QC 001002-3
- Revision of the sample quantities and the sequence of tests in Annex A
