What is BS EN 16602-70-38- High-reliability soldering about ?
BS EN 16602-70-38 specifies the technical requirements and quality assurance provisions for the manufacture and verification of high-reliability electronic circuits based on surface-mounted devices (SMD) and mixed technology.
BS EN 16602-70-38 defines acceptance and rejection criteria for high-reliability manufacture of surface-mount and mixed-technology circuit assemblies intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight.
BS EN 16602-70-38 prescribes requirements for electrical connections of leadless and leaded surface mounted devices (SMD) on spacecraft and associated equipment, utilizing a range of substrate assemblies and employing solder as the interconnection media.
Note: BS EN 16602-70-38 does not cover the qualification and acceptance of the EQM and FM equipment with surface-mount and mixed-technology.
Who is BS EN 16602-70-38 - High-reliability soldering for ?
BS EN 16602-70-38 on high-reliability soldering for surface-mount is applicable to:
- Aerospace electric equipment industries and systems
- Space systems and operations
- Spacecraft and related equipment manufacturers
- Quality control personnel for spacecraft products
- Alloy manufacturers
Why should you use BS EN 16602-70-38 - High-reliability soldering ?
Guidelines provided in BS EN 16602-70-38 helps you with technical requirements for high-reliability electronic circuits based on surface-mounted devices (SMD) and mixed technology on spacecraft and associated equipment and thus help in verifying the SMD assembly process is made on test vehicles (surface mount verification samples).
BS EN 16602-70-38 is structured such that the necessary level of quality is achieved, consistently maintained, and the high reliability of the end product assured.
BS EN 16602-70-38 covers proper tools, correct materials, design, and workmanship. Workmanship standards are included to permit discrimination between proper and improper work.
