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Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method | Status: Superseded, Withdrawn
description
BS EN 60068-2-69:2007outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices.
BS EN 60068-2-69:2007 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.
BS EN 60068-2-69:2007provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.
Details
Publisher
BS
File size
610.22 KB
Pages
28
Format
PDF
Publication date
2007-07-31
ISBN-13
978-0-580-55860-3
ISBN-13 plain
9780580558603
ISBN-10
0580558603
