What is BS EN 60068-2-83 - Wettability of electronic components used in surface mounting devices (SMD) about?
BS EN 60068-2-83 is the second part of an international standard used for environmental testing that specifies the test method for evaluating the wettability of electronic components used in surface mounting devices (SMD). BS EN 60068-2-83 you can manufacture good quality electronic components used in surface mounting devices (SMD).
BS EN 60068-2-83 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for Pass-fail purposes.
Note: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
Who is BS EN 60068-2-83 - Wettability of electronic components used in surface mounting devices (SMD) for?
BS EN 60068-2-83on Environmental testing is useful for:
- Manufacturer of electronic components
- Manufacturer of automotive parts
- Electronic engineer
Why should you use BS EN 60068-2-83 - Wettability of electronic components used in surface mounting devices (SMD)?
Surface Mount Technology is an area of electronic assembly. This technology is used in mounting electronic components to the surface of the printed circuit board (PCB).
BS EN 60068-2-83 specifies the test method and test procedure for identifying the wettability of these SMDs with solder pastes. The test method is as follows:
- Quick heating method helps in evaluating the wettability of electrodes of a component when the solder paste is melted in rapid temperature rise. In this method, the specimen is immersed in the solder paste before the temperature rise starts
- Synchronous method is useful in evaluating the wettability of electrodes of a component while the solder paste is melted due to a rapid temperature rise. The specimen is immersed in the solder paste when the temperature rise starts
- Temperature profile method helps in melting the solder pastes by using a similar temperature profile used in production. This test method is useful in evaluating the wettability of electrodes of a component
By applying BS EN 60068-2-83 you can ensure the sustainability of these surface mounted devices (SMD) in different climatic conditions. This results in manufacturing good quality electronic components used in SMDs.
