What is BS EN 60191-6-10 - Outline drawings of surface mounted semiconductor device packages about?
BS EN 60191-6-10 is the sixth part of a multi-series standard used for semiconductor devices that specifies the dimension for designing outline drawings of surface mounted semiconductor device packages. This helps in manufacturing good quality surface mounted semiconductor device packages.
BS EN 60191-6-10 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
Who is BS EN 60191-6-10 - Outline drawings of surface mounted semiconductor device packages for?
BS EN 60191-6-10 on outline drawings of surface mounted semiconductor device packages is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
Why should you use BS EN 60191-6-10 - Outline drawings of surface mounted semiconductor device packages?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60191-6-10 specifies the dimensions of these plastic very thin small outline non-lead packages (P-VSON). With the help of these dimensions, you can design and construct these surface mounted semiconductor device packages. This helps in identifying the materials to be used in manufacturing these packages.
BS EN 60191-6-10 can be your best guide in preparing the outline drawings of surface mounted semiconductor device packages. The packing helps in protecting these devices from the defects and failures that take place while transporting, storing, and handling. By applying BS EN 60191-6-10 you can design and manufacture good quality surface mounted semiconductor device packages.
