What is BS EN 60191-6-17 - Guidelines for packing surface mounted semiconductor devices about?
BS EN 60191-6-17 is the sixth part of an international standard used for semiconductor devices.
BS EN 60191-6-17 can be your best guide in packing these surface mounted devices which help in avoiding defects and failure in these devices that take place while transporting, storing, and handling.
BS EN 60191-6-17 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
Who is BS EN 60191-6-17 - Guidelines for packing surface mounted semiconductor devices for?
BS EN 60191-6-17 on Mechanical standardization of semiconductor devices is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
- Quality control executives
Why should you use BS EN 60191-6-17 - Guidelines for packing surface mounted semiconductor devices?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60191-6-17 specifies the dimensions and designs for packing the surface-mounted semiconductor devices. This helps in avoiding damages or failures while transporting, storing or handling these devices. With the help of BS EN 60191-6-17, you can prevent your client from the hazardous substances used in these devices.
BS EN 60191-6-17 can be your best guide in packing these surface mounted semiconductor devices which help in protecting these devices from external factors. By applying BS EN 60191-6-17 you can ensure the sustainability of these devices in different conditions. This also helps in keeping you and your environment clean, safe, and healthy.
