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summary
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA) | Status: Current
description
1 Scope
This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
Details
Publisher
BS
File size
1.69 MB
Pages
24
Format
PDF
Publication date
2010-04-30
ISBN-13
978-0-580-71947-9
ISBN-13 plain
9780580719479
ISBN-10
0580719479