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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages | Status: Current
Details
Publisher
BS
File size
426.22 KB
Pages
14
Format
PDF
Publication date
2002-03-29
ISBN-13
978-0-580-39260-3
ISBN-13 plain
9780580392603
ISBN-10
0580392600