What is BS EN 60191-6-20 - Measuring methods for package dimensions of small outline J-lead packages (SOJ) about?
BS EN 60191-6-20 is the sixth part of a multi-series standard used for the Mechanical standardization of semiconductor devices.
BS EN 60191-6-20 specifies methods to measure package dimensions of small outline J-lead- packages (SOJ), package outline form E in accordance with IEC 60191-4.
Who is BS EN 60191-6-20 - Measuring methods for package dimensions of small outline J-lead packages (SOJ)for?
BS EN 60191-6-20on Mechanical standardization of semiconductor devices is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
Why should you use BS EN 60191-6-20 - Measuring methods for package dimensions of small outline J-lead packages (SOJ)?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60191-6-20 specifies the rules for measuring method for package dimensions of small outline J-lead packages (SOJ). This measuring method are as follows:
- Mounting height A is useful in measuring the distance to a highest point
- Stand-off A1 helps in calculating the distance from the reference surface to the lowest point of the package
- Body thickness A2 is useful in obtaining the thickness of package
- Lead widths bp and b1, lead thickness c and c1 helps in measuring lead width and thickness
- Measures the Soldered position length
- Coplanarity y helps in calculating the vertical distances from the surface plate to the lowest surfaces
This method helps in avoiding defects or failures while transporting, storing, or handling these surface mounted semiconductor devices. By applying BS EN 60191-6-20 you can prevent these devices from external factors by using packing these devices.
