What is BS EN 60191-6 - Outline drawings for surface mounted semiconductor device packages about?
BS EN 60191-6 is the sixth part of a multi-series standard used for the Mechanical standardization of semiconductor devices. This helps in protecting these devices from external factors.
BS EN 60191-6 gives general rules for the preparation of outline drawings for surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3. It covers all surface-mounted devices discrete semiconductors with a lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.
Who is BS EN 60191-6 - Outline drawings for surface mounted semiconductor device packages for?
BS EN 60191-6 on Preparing the outline drawings for surface mounted semiconductor device packages is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
Why should you use BS EN 60191-6 - Outline drawings for surface mounted semiconductor device packages?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material. The packing of these surface mounted semiconductor devices is useful in protecting the materials while transporting, storing, and handling these devices.
BS EN 60191-6 specifies the rules for designing these devices in a systematic manner. The dimensions specified are useful in designing these surface mounted semiconductor device packages. With the help of these dimensions, you can identify the materials to be used while packing these devices.
BS EN 60191-6 can be your best guide in preparing the outline drawings for surface mounted semiconductor device packages. By applying BS EN 60191-6, you can protect these devices from external factors.
What’s changed since the last update?
BS EN 60191-6:2009 supersedes BS EN 60191-6:2004. BS EN 60191-6:2009 includes some technical changes with respect to BS EN 60191-6:2004. These include:
- Scope is modified to cover all surface-mounted devices discrete semiconductors with a lead count of greater or equal to 8
- Editorial modifications on several pages
- Technical revision to ball grid array package (BGA), especially its geometrical drawing format. (Two types of BGA would unify as one type as a result of revising the drawing format.)
