What is BS EN 60191-6-21 - Measuring methods for package dimensions of small outline packages (SOP) about?
BS EN 60191-6-21 is the sixth part of a multi-series standard used for the Mechanical standardization of semiconductor devices.
BS EN 60191-6-21 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance with IEC 60191-4.
Who is BS EN 60191-6-21 - Measuring methods for package dimensions of small outline packages (SOP) for?
BS EN 60191-6-21 on Mechanical standardization of semiconductor devices is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
Why should you use BS EN 60191-6-21 - Measuring methods for package dimensions of small outline packages (SOP)?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60191-6-21 specifies the rules for measuring method for package dimensions of small outline packages (SOP). This measuring method is as follows:
- Mounting height A is useful in calculating the distance to the highest point
- Stand-off A1 helps in measuring the distance from the reference surface to the lowest point of the package
- Body thickness A2 is useful in obtaining the thickness of the package
- Lead widths bp and b1, lead thickness c and c1 helps in calculating lead width and thickness
- Measures the Soldered portion length
- Coplanarity y helps in calculating the vertical distances from the surface plate to the lowest surfaces
- Calculates the virtual plane
By applying BS EN 60191-6-21 you can avoid defects or failures while transporting, storing, or handling these surface mounted semiconductor devices. This helps in preventing these devices from external factors by packing these devices.
