What is BS EN 60191-6-22 - Outline drawings of surface mounted semiconductor device packages about?
BS EN 60191-6-22 is the sixth part of a multi-series standard used for the mechanical standardization of semiconductor devices. This helps in designing and manufacturing good quality surface mounted semiconductor device packages.
BS EN 60191-6-22 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Who is BS EN 60191-6-22 - Outline drawings of surface mounted semiconductor device packages for?
BS EN 60191-6-22 on outline drawings of surface mounted semiconductor device packages is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
Why should you use BS EN 60191-6-22 - Outline drawings of surface mounted semiconductor device packages?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material. BS EN 60191-6-22 specifies the dimensions of Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array which are useful in designing these semiconductor device packages. This helps in identifying the material to be used while constructing surface mounted semiconductor device packages.
BS EN 60191-6-22 can be your best guide in preparing the outline drawings of surface mounted semiconductor device packages. With the help of these packages, you can avoid defects or failures that arise while transporting, storing, and handling these devices. This results in designing and manufacturing good quality surface mounted semiconductor device packages.
