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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP) | Status: Current
Details
Publisher
BS
File size
434.59 KB
Pages
20
Format
PDF
Publication date
2001-05-15
ISBN-13
978-0-580-37243-8
ISBN-13 plain
9780580372438
ISBN-10
058037243X