What is BS EN 60191-6-6 - Fine pitch land grid array (FLGA) used in packing semiconductor devices about?
BS EN 60191-6-6 is the sixth part of a multi-series standard used for Fine pitch land grid array (FLGA) used in packing semiconductor devices. This helps in designing and manufacturing good quality fine pitch land grid array (FLGA) used in packing surface mounted semiconductor device.
BS EN 60191-6-6 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA) whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
Who is BS EN 60191-6-6 - Fine pitch land grid array (FLGA) used in packing semiconductor devices for?
BS EN 60191-6-6 on Mechanical standardization of semiconductor devices is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
Why should you use BS EN 60191-6-6 - Fine pitch land grid array (FLGA) used in packing semiconductor devices?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60191-6-6 specifies the outline drawing and dimensions for fine pitch land grid array (FLGA) used in packing surface mounted semiconductor devices. This helps interchange these fine pitch land grid arrays (FLGA) according to their semiconductor devices.
BS EN 60191-6-6 can be your best guide in designing and manufacturing good quality fine pitch land grid arrays (FLGA) used in packing the surface mounted semiconductor device. This is useful in avoiding defects while transporting, storing, and handling these surface mounted semiconductor devices.
