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Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat | Status: Revised, Withdrawn
Details
Publisher
BS
File size
508.68 KB
Pages
28
Format
PDF
Publication date
2003-07-07
ISBN-13
978-0-580-42197-6
ISBN-13 plain
9780580421976
ISBN-10
058042197X