What is BS EN 60749-29 - Latch-up test of integrated circuits for semiconductor devices about?
BS EN 60749-29 is the 29th part of an international standard used for semiconductor devices that specifies the test method for integrated circuits. By using BS EN 60749-29 you can manufacture good quality semiconductor devices.
BS EN 60749-29 covers the I-test and the overvoltage latch-up testing of integrated circuits. This test is classified as destructive.
Note: This test method is primarily applicable to CMOS devices. Applicability to other technologies must be established.
Note: The classification of latch-up as a function of temperature is defined in 3.1 and the failure level criteria are defined in 3.2
Who is BS EN 60749-29 - Latch-up test of integrated circuits for semiconductor devices for?
BS EN 60749-29 on Semiconductor devices is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
- Quality control executives
Why should you use BS EN 60749-29 - Latch-up test of integrated circuits for semiconductor devices?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60749-29 specifies the latch-up test methods and test procedures for semiconductor devices. This test method is useful in determining the latch-up characteristics of integrated circuits and helps in identifying the defects or failures in these devices. With the help of BS EN 60749-29, you can classify and evaluate the level of these semiconductor devices.
By applying BS EN 60749-29 you can ensure the reliability and sustainability of these devices in different climatic conditions. This helps in reducing the failures which result in manufacturing good quality semiconductor devices.
What’s changed since the last update?
BS EN 60749-29:2011 supersedes BS EN 60749-29:2003. BS EN 60749-29:2011 includes some technical changes with respect to BS EN 60749-29:2003. These include:
- A number of minor technical changes
- The addition of two new annexes covering the testing of special pins and temperature calculations.
