What is BS EN 60749-34 - Mechanical and climatic test methods for semiconductor devices about?
BS EN 60749-34 is the 34th part of a multi-series standard used for Semiconductor devices. this helps in manufacturing good quality Semiconductor devices.
BS EN 60749-34 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forwarding conduction (load currents) are periodically applied and removed, causing rapid changes in temperature.
The power cycling test is intended to simulate typical applications in power electronics and is complementary to high temperature operating life (see IEC 60749-23). Exposure to this test may not induce the same failure mechanisms as exposure to air-to-air temperature cycling, or to the rapid change of temperature using the two-fluid-baths method. This test causes wear-out and is considered destructive.
Note: BS EN 60749-34 is not the intention of this specification to provide prediction models for lifetime evaluation.
Who is BS EN 60749-34 - Mechanical and climatic test methods for semiconductor devices for?
BS EN 60749-34 on Mechanical and climatic test methods for Semiconductor devices is useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
Why should you use BS EN 60749-34 - Mechanical and climatic test methods for semiconductor devices?
A semiconductor device is an electronic component that contains the electronic properties of semiconductor material.
BS EN 60749-34 specifies the power cycling, mechanical and climatic test method for semiconductor devices. This test method is useful in determine the thermal resistance and mechanical stresses of these devices. With the help of inspections, you can avoid the defects and failures of these Semiconductor devices. The measurement method is useful in measuring the electronic characteristics of these devices.
By applying BS EN 60749-34, you can ensure the sustanability of these devices in different climatic conditions. This results in manufacturing good quality semiconductor devices.
What’s changed since the last update?
BS EN 60749-34:2010 supersedes BS EN 60749-34:2004. BS EN 60749-34:2010 includes some technical changes with respect to BS EN 60749-34:2004. These include:
- The specification of tighter conditions for more accelerated power cycling in the wire bond fatigue mode
- Information that under harsh power cycling conditions high current densities in a thin die metalization might initiate electromigration effects close to wire bond
