What is BS EN 61189-5-4 - Test methods for materials and assemblies about? 
Printed board assemblies are used in almost every electronic product to mechanically support and electrically connect electronic components. BS EN 61189-5-4 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
BS EN 61189-5-4 focuses on test methods for solder alloys, fluxed and non-fluxed solid wire, based on existing IEC 61189-5 and IEC 61189-6. In addition, BS EN 61189-5-4 includes test methods for solder alloys, fluxed and non-fluxed solid wire, and lead-free soldering.
Who is BS EN 61189-5-4 - Test methods for materials and assemblies for? 
BS EN 61189-5-4 on test methods for materials and assemblies is useful for organizations associated with: 
- Manufacturing of electronic devices
- Maintenance and augmentation
- Design and installation of electronic devices
- Fault management
- Quality management
Why should you use BS EN 61189-5-4 - Test methods for materials and assemblies?
Electronic components are used in applications that rely on mechanical or electric systems for their operation. They are essential to any work on electronics systems for creating signals and capturing responses from electronic devices. So, it is important to test the quality and functionality of electric components.
BS EN 61189-5-4 contains test methods for evaluating the robustness of materials or components for printed board assemblies. The methods are self-contained, with sufficient detail and description to achieve uniformity and reproducibility in the procedures and test methodologies.
The tests shown in BS EN 61189-5-4 are grouped according to the following principles:
- P: preparation/conditioning methods
- V: visual test methods
- D: dimensional test methods
- C: chemical test methods
- M: mechanical test methods
- E: electrical test methods
- N: environmental test methods
- X: miscellaneous test methods
To facilitate reference to the tests, to retain the consistency of presentation, and to provide for future expansion, each test is identified by a number (assigned sequentially) added to the prefix (group code) letter showing the group to which the test method belongs.
The guidelines in BS EN 61189-5-4 help you assess electrical materials, printed boards and other interconnection structures and assemblies so that the end customer gets a superior quality product.
