BS EN 61190-1-2:2007

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Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly | Status: Revised, Superseded, Withdrawn

Details

Publisher BS

File size 1.38 MB

Pages 22

Format PDF

Publication date 2007-07-31

ISBN-13 978-0-580-55336-3

ISBN-13 plain 9780580553363

ISBN-10 0580553363

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File size 1.38 MB

Pages 22

Format PDF

Publication date 2007-07-31

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