What is BS EN 61837-3 - Metal enclosures for Surface mounted piezoelectric devices about?
BS EN 61837-3 is an international standard that discusses surface-mounted piezoelectric devices for frequency control and selection. The main objective is they are strong and durable, providing excellent protection for any electrical gadget.
BS EN 61837-3 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in metal enclosures and is based on IEC 61240 which standardized layout rules of outline drawings of the surface-mounted devices.
Who is BS EN 61837-3 - Metal enclosures for Surface mounted piezoelectric devices for?
BS EN 61837-3 on surface-mounted piezoelectric devices for frequency control and selection is useful for:
- Manufacturers and suppliers of SMD devices
- Dealers and importers of SMD devices
- SMD customers
- Aerospace industry
Why should you use BS EN 61837-3 - Metal enclosures for Surface mounted piezoelectric devices?
Metal enclosures are strong and durable, providing excellent protection for any electrical gadget. SMD exposure to different environments may cause failure and malfunctioning, so keeping them in enclosures keeps them safe.
BS EN 61837-3 provides users guidance on configuration of enclosures, designation of types, metal enclosure dimensions, lead connections, designation of metal enclosures, enabling the flexibility in choice to find the appropriate metal enclosure box.
Adopting BS EN 61837-3 enables users to find out frequency control and selection for surface-mounted piezoelectric devices also will protect them from rain, snow, sleet, and extreme weather fluctuations.
What’s changed since the last update?
BS EN 61837-3:2015 supersedes BS EN 61837-3:2001 which is withdrawn. BS EN 61837-3:2015 includes some technical changes with respect to BS EN 61837-3:2001. These include:
- The outline drawing is defined as one set of drawings consisting of four views, which are the view from above, the front view, the view from the right, and the view from below; the view from the right was drawn optionally in the previous edition.
- The height of package (G1) is eliminated, instead, total height is expressed by the symbol letter G or with a subscript number
- The dimensions of terminal lead spacing are shown by the center position of the terminal leads and its basic value e is 2.54 × n mm (n is an integer) and 1,27 × n mm for package dimensions smaller than 6 mm (See IEC 61240:2012, 5.5). If the terminal lead spacing is not a multiple of the basic value, a subscript number such as e1, e2 is attached, e.g. e1, e2, etc. If there are plural spacing values, the subscript number is followed by a hyphen, and numbers such as e1-1, e1-2, etc
- In terminal land areas, the lengths of each terminal pad are now expressed with maximum values for consumers’ convenience. They were expressed as minimum values in the previous edition of IEC 61837-3
- If there are plural identical enclosures with different heights, each enclosure was expressed by a dash (/) and a two-digit number after the basic type name. The identity references are given in the table of the sheet
- The configurations of the enclosures were revised as shown in Table 1.
