What is BS EN 62047-10 - Micro-pillar compression test for MEMS materials about?
BS EN 62047-10 is the 10th part of the multi-series standard used for Semiconductor devices. by using BS EN 62047-10 you can manufacture good quality MEMS devices.
BS EN 62047-10 specifies a micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate the effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a the specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micromachining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.
Who is BS EN 62047-10 - Micro-pillar compression test for MEMS materials for?
BS EN 62047-10 on Micro-electromechanical devices are useful for:
- Manufacturers of semiconductor devices
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineers
- Semiconductor foundries
- Quality control executives
Why should you use BS EN 62047-10 - Micro-pillar compression test for MEMS materials?
Micro-electromechanical systems (MEMS) are a process technology that is useful in creating tiny integrated devices or systems. These devices are useful in combining mechanical and electrical components.
BS EN 62047-10 specifies the micro-pillar compression test method and test procedure for MEMS materials. This test method is useful in calculating the uniaxial compressive stress-strain that results in obtaining elasticity and yield strength of compressive modulus used in MEMS devices.
By applying BS EN 62047-10 you can ensure the sustainability of these materials in different climatic conditions. This results in manufacturing good quality MEMS devices.
