What is BS EN 62047-25 - Silicon-based MEMS fabrication technology?  
BS EN 62047-25 is the 25th part of an international standard used for semiconductor devices. This test method helps in measuring the interfacial adhesion energy in microelectromechanical devices.
BS EN 62047-25 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based microelectromechanical system (MEMS).
BS EN 62047-25 is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
Note: BS EN 62047-25 does not need intricate instruments (such as scanning probe microscopy and nanoindenter) and to prepare the test specimen especially.
Who is BS EN 62047-25 - Silicon-based MEMS fabrication technology for? 
BS EN 62047-25 on semiconductor devices useful for:
- Semiconductor foundries
- Manufacturers of electronic devices
- Manufacturers of automobiles
- Electrical engineers
Why should you use BS EN 62047-25 - Silicon-based MEMS fabrication technology?  
Micro-electromechanical systems (MEMS) are a technology useful in creating integrated devices or systems that are combined with mechanical and electrical properties. They are made using integrated circuit (IC) batch processing techniques and can be as small as a few micrometres to as large as millimetres.
Micro anchor, fixed on the substrate through the micro bonding area, provides mechanical support of the movable sensing/actuating functional components in MEMS devices. With the devices scaling, the bonding strength degradation, induced by defects, contaminations, and thermal mismatch stress on the bonding surface, becomes severer. BS EN 62047-25 specifies an in situ testing method of the pull-press and shearing strength based on a patterned technique.
Since the testing structure in this standard can be implanted in device fabrication as a standard detection pattern, BS EN 62047-25 can provide a bridge, by which the fabrication foundry can give some quantitative reference for the designer.
BS EN 62047‑25 assists users in measuring the accurate dimensions to determine the mechanical properties of micro-electromechanical systems (MEMS) materials. The machining of the devices helps in preventing unintended cracks or flaws in Microelectromechanical devices.
BS EN 62047-25 provides users testing method for measuring pull-press and shearing strength of micro bonding. BS EN 62047-25 also provides users with a step-by-step procedure for the method, enabling users to do the method correctly.
With the adoption of BS EN 62047-25, users can measure the pull-press and shearing strength of the micro bonding area, ensuring the bonding strength, operability and longevity in micro-electromechanical devices.
