What is BS EN 62258-1 – Semiconductor die products about?
BS EN 62258-1 is the first part of an international standard that covers semiconductor die products. It defines the requirements for the data that are needed to describe the semiconductor die products and is intended as an aid to the design of and procurement of assemblies incorporating die products.
BS EN 62258-1 covers the requirements for data, including:
- Product identity
- Product data
- Die mechanical information
- Test, quality, assembly, and reliability information
- Handling, shipping, and storage of information
BS EN 62258-1 covers the specific requirements for the data that are needed to describe the geometrical properties of die products, their physical properties, and the means of connection necessary for their use in the development and manufacture of products. It also contains, in the annexes, a vocabulary and a list of common acronyms.
Who is BS EN 62258-1 - Semiconductor die products for?
BS EN 62258-1 on semiconductor die products is useful for:
- Military systems
- Tele-Communication sector
- Manufacturers and designers of electronic devices
- Manufacturers and designers of semiconductor products
- Suppliers and dealers of semiconductor products
- Test laboratories
Why should you use BS EN 62258-1 - Semiconductor die products?
BS EN 62258 series is based on the work carried out in the ESPRIT 4th Framework project GOOD-DIE which resulted in the publication of the ES59008 series of European specifications. Organizations that helped prepare BS EN 62258-1 included the European IST ENCASIT project, JEITA, JEDEC, and ZVEI.
It covers the specific requirements for the data that are needed to describe the geometrical properties of semiconductor die products, their physical properties, and the means of connection necessary for their use in the development and manufacture of products.
BS EN 62258-1 has been developed to facilitate the users with the production, supply and use of semiconductor die products, including
- Wafers
- Singulated bare die
- Die and wafers with attached connection structures
- Minimally or partially encapsulated die and wafers
BS EN 62258-1 provides you with the details of the requirements, that enable the users (e.g., suppliers of die devices) to furnish the information that is necessary and sufficient for consumers at any stages of design, procurement, manufacture, and test of products containing them.
