What is BS EN 62258-6 – Thermal simulation of semiconductor die products about?
BS EN 62258-6 is the sixth part of the multi-series standard that deals with the aspects of semiconductor die products. It covers the requirements for information concerning thermal stimulation of semiconductor die products.
BS EN 62258-6 determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include a bare semiconductor die, with or without connection structures, and minimally packaged semiconductor die.
Note: BS EN 62258-6 does not place an obligation on a supplier to make the information public. Any information that a supplier considers to be proprietary or commercially sensitive may be supplied under the terms of a nondisclosure agreement.
Who is BS EN 62258-6 - Thermal simulation of semiconductor die products for?
BS EN 62258-6 on Thermal simulation of semiconductor die products is useful for:
- Manufacturers and suppliers of semiconductor die devices
- Manufacturers of electronic devices
- Designers of semiconductor die devices
- Quality control personnel
- Testing authorities
- Electrical engineers
Why should you use BS EN 62258-6 - Thermal simulation of semiconductor die products?
Semiconductor die products consist of a component called ‘die’, a small block of semiconducting material on which a given functional circuit is fabricated.
BS EN 62258-6 gives the requirements and recommendations, that apply to thermal simulation models used to perform an analysis of the thermal excursions within the die, that affect the electrical performance of the die and system.
BS EN 62258-6 informs users about the description of the test method and measurement test conditions that provide them with ambient temperature and airflow, reference temperature, and reference location, under which thermal resistance measurements have been carried out.
BS EN 62258-6 facilitates the production, supply, and application of semiconductor die products, including wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die, and wafers.
BS EN 62258-6 helps to assist its users who are involved in the production and supply chain for die devices, to comply with the requirements of IEC 62258-1 and IEC 62258-2.
