What is BS EN 62276 - Single crystal wafers for surface acoustic wave (SAW) device applications about?
BS EN 62276 is an international standard that discusses single crystal wafers for surface acoustic wave (SAW) device applications, enabling visual inspection, high transmission and optical clarity in manufacturing processes.
BS EN 62276 applies to the manufacture of synthetic quartz, lithium niobate (LN), lithium tantalate (LT), lithium tetraborate (LBO), and lanthanum gallium silicate (LGS) single crystal wafers intended for use as substrates in the manufacture of surface acoustic wave (SAW) filters and resonators.
Who is BS EN 62276 - Single crystal wafers for (SAW) device applications for? 
BS EN 62276 on single crystal wafers for surface acoustic wave (SAW) device applications is useful for: 
- Manufacturer of surface acoustic wave devices
- Manufacturer of electronic communication devices
- Telecommunication industry
- Quality testing personnel
Why should you use BS EN 62276 - Single crystal wafers for (SAW) device applications?  
A variety of piezoelectric materials are used for surface acoustic wave (SAW) filter and resonator applications. Earlier, wafer specifications were usually negotiated between users and suppliers. BS EN 62276 was prepared to provide industry-standard technical specifications for manufacturing piezoelectric single-crystal wafers to be used in surface acoustic wave devices.
Visual inspections for front surface inspection method defined in BS EN 62276 in order to avoid bias and accurately gauge the number of defects present in a given sample population, wafers to inspected are chosen at random and with consistent sampling frequency.
The guidance in BS EN 62276 helps users to avoid contamination or damage during shipping or storage and to prevent stray ambient light from interfering with the inspector’s ability to clearly see the surface.
What’s changed since the last update?
BS EN 62276:2016 supersedes BS EN 62276:2013 which is withdrawn. BS EN 62276:2016 includes some technical changes with respect to BS EN 62276:2013. These include: 
- Corrections of Euler angle indications in Table 1 and axis directions in Figure 3.
- The definition of “twin“ is not explained clearly enough in 3.3.3. Therefore it is revised by a more detailed definition.
- Etch channels maximum number at quartz wafer of seed which does not pass through from surface to back surface are classified for three grades in 4.2.13 a). Users use seed portions of quartz wafers for devices. They request quartz wafers with fewer etch channels in seeds to reduce defects of devices. The classification of etch channels in the seed may prompt a rise in quartz wafer quality. 
