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summary
Semiconductor devices. Time-dependent dielectric breakdown (TDDB) test for inter-metal layers | Status: Current
description
1 Scope
This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
Details
Publisher
BS
File size
1.3 MB
Pages
20
Format
PDF
Publication date
2010-12-31
ISBN-13
978-0-580-75206-3
ISBN-13 plain
9780580752063
ISBN-10
0580752063