What is BS EN 62878-1-1 - Device embedding assembly technology about?
BS EN 62878-1-1 is the first part of the international standard used for device embedding assembly technology that specifies the requirements and test methods. Guidelines in BS EN 62878-1-1 can help you in applying safety requirements while performing the test method.
BS EN 62878-1-1 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3.
BS EN 62878-1-1 is applicable to device embedded substrates fabricated by the use of the organic base material, which includes for example active or passive devices, discrete components formed in the fabrication process of the electronic wiring board, and sheet formed components.
Note: BS EN 62878-1-1 neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.
Who is BS EN 62878-1-1- Device embedding assembly technology for?
BS EN 62878-1-1 on device embedding assembly technology is useful for:
- Manufacturers of electronic devices
- Manufacturers of semiconductor devices
- Manufacturers of printed or circuit boards
- Embedded Industry
Why should you use BS EN 62878-1-1- Device embedding assembly technology?
Embedded systems are designed to control a specific function within a device. Embedded substrate technology is the inclusion of at least one active or passive electrical component within the conductive layers of a substrate.
BS EN 62878-1-1 provides you guidance on electrical, mechanical, environmental, and resistance to migration tests for device embedding assembly technology. BS EN 62878-1-1 also provides you with a step-by-step procedure for the method, enabling you to do the method correctly.
BS EN 62878-1-1 assists you in aligning all the materials with the embedding technology and components that are useful in applying the safety requirements to the base material and components while assembling the embedded substrates. This embedding technology helps in determining the electrostatic discharge that helps in avoiding the defects in device embedded substrates.
BS EN 62878-1-1 provides you guidance on visual inspection and micro-sectioning for checking the appearance, finish, and pattern of specimens with the naked eye or a magnifying glass for individual specifications, state, appearance, and dimensions of the plated through-hole, the via in the build-up layer, the conductor, the interlayer distance, the conductor distance, and the connections to the embedded device.
The electrical performance tests outlined in BS EN 62878-1-1 help you in measuring the electrical characteristics of embedded substrate devices. The mechanical test of devices ensures the resistivity of soldering heat and helps in evaluating the resistance of a device embedded substrates (DES).
The adoption of BS EN 62878-1-1 enables you to test the electrical and mechanical characteristics of device embedded substrates that help in understanding the structure, design, and fabrication process and use of device embedded substrates (DES) in the industry.
