What is BS EN IEC 60352‑5 about?
BS EN IEC 60352‑5 is the fifth part of the multi-series international standard on Solderless connection
BS EN IEC 60352‑5 applies to solderless press-in connections for use in electrical and electronic equipment and components. The press-in connection consists of a termination having a suitable press-in zone that is inserted into a hole aboard.
Note: BS EN IEC 60352‑5 covers:
- The qualification test schedule applies to individual press-in connections to demonstrate the suitability of the press-in zone.
- These press-in connections are tested to the specification provided by the manufacturer of the press-in termination (see 4.6) taking into account the requirements of Clause 4.
- The qualification is independent of the application of the press-in zone in a component.
- The application test schedule applies to press-in connections which are part of a
- component and are already qualified to the qualification test schedule.
- Test sequences focus on the performance of the press-in connection which is affected by the implementation in a component.
Who is BS EN IEC 60352‑5 for?
BS EN IEC 60352‑5 on Solderless connections is useful for:
- Manufacturer of Press-in termination
- Manufacturer of electronic devices
- Electrical Engineers
- Manufacturers of solder irons
Why should you use BS EN IEC 60352‑5?
A semiconductor device is an electronic component that relies on the electronic properties of semiconductor material for its function.
BS EN IEC 60352‑5 will help you in testing the quality of press-in termination and also helps in sustaining the solderless connections in ambient temperature and the humid climate.
BS EN IEC 60352‑5 ensure a minimum holding force of a press-in connection against the press-in direction and also help in meeting the requirements for plated through holes in performing the printed test board.
BS EN IEC 60352‑5 helps in reducing metal cracks by replacing the new press-in connections.
BS EN IEC 60352‑5 helps in measuring contact resistance which results in sustaining press-in connection in different climatic conditions.
BS EN IEC 60352‑5 is useful in avoiding the duplicate test for components with several press-in terminations. The mounting method helps in pressing the complete components on a printed board.
Overall, BS EN IEC 60352-5 will help you determine the suitability of press-in connections under mechanical, electrical, and atmospheric conditions that will lead to a clean solderless joint between two elements.
What’s changed since the last update?
BS EN IEC 60352‑5:2020 supersedes BS EN 60352‑5:2012. BS EN IEC 60352‑5:2020 includes some technical changes concerning BS EN 60352‑5:2012. These include:
- Modification of upper limit of the copper thickness of the plated-through-hole to reflect actual market trends and manufacturing practices
- Removal of bending test, as this test is very specific for applications of press-in technology no longer common
- Adding graphs to document the press-in and push-out force, since this is common testing practice and provides further insight into the mechanical performance of the contact zone
- Reducing the number of test specimens required, since in the previous testing scheme a lot of test samples were discarded
- Added Figure 7b to show V and A connection locations when the press-in termination does not protrude through the bottom side of the board
