What is BS EN IEC 60749‑20 about?
BS EN IEC 60749‑20 is the 20th part of semiconductor the multi-series European standard on semiconductor devices.
BS EN IEC 60749‑20 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
Who is BS EN IEC 60749‑20 for?
BS EN IEC 60749‑20 on Semiconductor devices is useful for:
- Semiconductor foundries
- Manufacturer of electronic devices
- Manufacturer of automobile
Why should you use BS EN IEC 60749‑20?
Semiconductor devices are electronic components that rely on the electronic properties of semiconductor materials for their function.
Package cracking and electric failure take place when the soldering heat is increased, and the moisture has been absorbed into surface mounted devices during storage. These problems are solved with the help of BS EN IEC 60749‑20, as these surface mounted devices (SMDs) are evaluated to heat resistance after being soaked in an environment.
BS EN IEC 60749‑20 helps in moisturizing surface mount devices (SMDs) before and after opening the dry-packed SMDs.
BS EN IEC 60749‑20 will help you in resisting the soldering heat of Semiconductor devices which are packed as plastic encapsulated surface mount devices (SMDs).
Overall, BS EN IEC 6074920 is a comprehensive guide to the protection and assurance of quality and safety of products and equipment encapsulated in plastic from moisture and soldering heat.
What’s changed since the last update?
BS EN IEC 60749‑20:2020 supersedes BS EN 60749‑20:2009. BS EN IEC 60749‑20:2020 includes some technical changes concerning BS EN 60749‑20:2009:
- Incorporation of a technical corrigendum to IEC 60749-20:2008 (second edition)
- Inclusion of new Clause 3
- Inclusion of explanatory notes
