BS EN IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for time to delamination. T260, T288, T300 | Status: Current

1 Scope This part of IEC 61189 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 °C, but are not limited to these values.