loading preview...
summary
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (Td) using TGA | Status: Current
description
1 Scope
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).
Details
Publisher
BS
File size
710.02 KB
Pages
14
Format
PDF
Publication date
2021-11-05
ISBN-13
978-0-539-12605-1
ISBN-13 plain
9780539126051
ISBN-10
0539126051