What is BS EN IEC 61189‑5‑301 about?
BS EN IEC 61189‑5‑301 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).
This type of solder paste is used for connecting wiring and components in high-density printed circuit boards which are used in electronic or communication equipment and such, equipping fine wiring (e.g., minimum conductor widths and minimum conductor gaps of 60 μm or less).
Who is BS EN IEC 61189‑5‑301 for?
BS EN IEC 61189‑5‑301 on test methods for electrical materials and printed boards are useful for:
- Quality assurance team
- Manufacturers of soldering pastes
- Manufacturers of PCB circuits
- Electrical engineers and technicians
- Production teams
- Testing personnel
Why should you use BS EN IEC 61189‑5‑301?
Soldering paste is used to electrically connect the components on printed circuit boards. It also holds the components on the printed circuit boards. Considering the environmental changes within a semiconductor it could affect the soldering pastes performance and even compromise its functionality.
BS EN IEC 61189‑5‑301 provides you with a series of test methods like trace spiral pump method, printability test, slump test, reflow test and high-temperature observation test.
These test methods enable you to evaluate the physical properties and quality of the soldering paste and estimate the performance of the solder paste in operation conditions.
The guidelines of BS EN IEC 61189‑5‑301 ensure the use of reliable soldering paste in your circuit boards.
