What is BS EN IEC 61189‑5‑502 about?
BS EN IEC 61189‑5‑502 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.
An assembly process involves several different process materials including solder flux, solder paste, solder wire, underfill materials, adhesives, staking compounds, temporary masking materials, cleaning solvents, conformal coatings and more. The test employs two different test conditions of 85 °C and 85 % relative humidity (RH), preferred for a process that includes cleaning, or 40 °C and 90 % relative humidity (RH), preferred for processes where no cleaning is involved.
Note: 40 °C and 93 % RH can be used as an alternative to 40 °C and 90 % RH. Additional information is provided in 5.4 and A.5.2.
Who is BS EN IEC 61189‑5‑502 for?
BS EN IEC 61189‑5‑502 on — Surface insulation resistance (SIR) testing of electrical assemblies is useful for:
- Electrical material production line workers
- Technicians who work in assembling
- Electrical engineers
- Quality assurance team who checks the productivity
Why should you use BS EN IEC 61189‑5‑502?
Assemblies are a combination of multiple process materials and have to be well preserved and tested out to determine how they would perform in the final product.
BS EN IEC 61189‑5‑502 covers the procedure, guidance about assemblies, surface insulation resistance testing, general test methods. These test methods help you evaluate how the assemblies would perform in field conditions.
The guidelines of BS EN IEC 61189‑5‑502 enable you to evaluate the performance of electrical assemblies and assure quality control by highlighting defects if there are any.
