What is BS EN IEC 61189‑5‑601 about?
BS EN IEC 61189‑5‑601 is a part of the BS EN IEC 61189 multi-series that focuses on test methods for PCBs. BS EN IEC 61189‑5‑601 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
Who is BS EN IEC 61189‑5‑601 for?
BS EN IEC 61189‑5‑601 on test methods for electrical material is useful for:
- Manufacturers of semiconductor devices
- Electrical and electronic engineers
- Quality control personnel
Why should you use BS EN IEC 61189‑5‑601?
BS EN IEC 61189‑5‑601 provides test methods to ensure that the printed boards can resist the heat load to which they are exposed during soldering.
BS EN IEC 61189‑5‑601 also specifies resistance to soldering heat the ability of the component to withstand the highest temperature in terms of the temperature gradient, peak temperature, and duration of the soldering process, within the applicable temperature range of the solder alloy.
BS EN IEC 61189‑5‑601 ensures the soldering ability of the solder joint and of the lands of the printed boards.
