What is BS EN IEC 61760‑1 about?
BS EN IEC 61760 series covers surface mounting technology. BS EN IEC 61760-1 is the first part of a series of documents. BS EN IEC 61760‑1 is an international standard for surface mounting technology that specifies the test methods for conducting tests and ensures that different surface mounting devices (SMDs) can be attached at the same place for the mounting process while assembling.
BS EN IEC 61760‑1 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications.
Note: Some of the requirements for component specifications in BS EN IEC 61760‑1 are also applicable to components with leads intended for mounting on a circuit board
Who is BS EN IEC 61760‑1 for?
BS EN IEC 61760‑1 on surface mounting technology is useful for:
- Manufacturer of electronic devices
- Manufacturer of electronic circuits
- Electronic engineers
- Computer hardware industry
Why should you use BS EN IEC 61760‑1?
Surface-mount technology is a method that helps in mounting the electrical components directly on the surface of printed circuit boards.
BS EN IEC 61760‑1 helps in designing the surface mounting components (SMDs) which result in the durability of component marking. The general requirement specified in BS EN IEC 61760‑1 for the components which help to withstand various mechanical, thermal and chemical stresses during the assembling process without being damaged or degrade.
BS EN IEC 61760‑1 is useful in the assembling process that helps to withstand cleaning, post assembly and repairing processes. The soldering process ensures resistivity to vacuum, marking, cleaning solvent and resistance to soldering heat. This BS EN IEC 61760‑1 determines the performance of the surface mounting components (SMDs).
BS EN IEC 61760‑1 specifies the test methods and mechanical, electrical and technical characteristics of surface mounting components (SMDs). This test method is useful in verifying the different surface mounting components (SMDs) that can be attached at the same place in the mounting process while assembling it.
What’s changed since the last update?
BS EN IEC 61760‑1:2020 supersedes BS EN 61760‑1:2006. BS EN IEC 61760‑1:2020 includes some technical changes with respect to BS EN 61760‑1:2006. These changes include the inclusion of additional mounting methods such as conductive glue bonding, sintering and solderless interconnection.
