What is BS EN IEC 61760‑3 about?
BS EN IEC 61760‑3 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through-hole reflow soldering technology.
Furthermore, BS EN IEC 61760‑3 provides component users and manufacturers with a reference set of typical process conditions used in through-hole reflow soldering technology.
Who is BS EN IEC 61760‑3 for?
BS EN IEC 61760‑3 on surface mounting technology is useful for through-hole reflow components:
- PCB (Printed Circuit Board) assembly
- Electronics manufacturing
- Transistors and computer motherboards
Why should you use BS EN IEC 61760‑3?
The object of BS EN IEC 61760‑3 is to ensure that components with leads intended for through-hole reflow and surface mounting components can be subjected to the same placement and mounting processes. Hereto, this document defines tests and requirements that need to be part of any component generic, sectional, or detail specification, when through-hole reflow, soldering is intended.
BS EN IEC 61760‑3 provides guidance regarding inserted into the circuit board's through-hole g the reflow soldering process for electronic component terminals is inserted into the through-hole of the circuit board. It also describes electronic components with leads that are intended to be subject to through-hole reflow soldering.
What’s changed since the last update?
BS EN BS EN IEC 61760‑3:2021 supersedes BS EN 61760‑3:2010. BS EN BS EN IEC 61760‑3:2021 includes some technical changes concerning BS EN 61760‑3:2010. These include:
- Change position tolerance requirement (0,4 mm maximum to between 0,2 mm and 0,4 mm)
- Introduce the through-hole vacant method as a solder paste supply method
