What is BS EN IEC 62677-3-103-Heat-shrinkable polyolefin conductive moulded shapes about?
BS EN IEC 62677-3 is an international standard on specifications for materials used for heat-shrinkable low and medium voltage moulded shapes. Materials which conform to this specification meet established levels of performance.
BS EN IEC 62677-3-103 is one of the parts in the multi-series that is applicable to heat shrinkable low and medium voltage moulded shapes, conductive, in a range of configurations suitable for environmental sealing, mechanical protection, strain relief for power cable terminations, joints and stop ends. These moulded shapes have been found suitable for use for temperatures between −40 ºC and 100 ºC.
The moulded shapes can be supplied with a pre-coated adhesive and materials that conform to this specification meet established levels of performance.
Who is BS EN IEC 62677-3-103- Heat-shrinkable polyolefin conductive moulded shapes for?
BS EN IEC 62677-3-103 on moulded shapes for medium voltage applications is relevant to:
- Manufacturers of heat shrinkable moulded shapes
- Manufacturers of medium-voltage applications
- Manufacturers and suppliers of polyolefin
- Product design engineers
- Electrical industry
Why should you use BS EN IEC 62677-3-103- Heat-shrinkable polyolefin conductive moulded shapes?
BS EN IEC 62677-3-103-compliant tests are designed to control the quality of the moulded shapes.
BS EN IEC 62677-3-103 provides requirements related to dimensions, heat shock, tensile strength, dimensional stability and volume resistivity. Conformance with the requirements are based on the results from test sheets, (2 ± 0,15) mm thick, unless otherwise specified, which shall be prepared from the same heat-shrinkable material and conditions (including cross-linking) that is used to manufacture the heat shrinkable moulded shapes.
Overall, BS EN IEC 62677-3-103 is your one-stop guide to making the right selection of insulating materials, play a positive role in the performance of medium voltage applications.
